By Professor Jang-Kyo Kim

Journal articles

Sham ML; Kim JK; Park JH, 2007, 'Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin', Computational Materials Science, 40, pp. 81 - 89, http://dx.doi.org/10.1016/j.commatsci.2006.11.004

KIM J-K, 2007, 'IMPACT DAMAGE EVALUATION OF FIBRE-REINFORCED COMPOSITE MATERIALS AND STRUCTURES', International Conference on Aerospace Sciences and Aviation Technology, 12, pp. 1 - 12, http://dx.doi.org/10.21608/asat.2007.24387

Li J; Vaisman L; Marom G; Kim JK, 2007, 'Br treated graphite nanoplatelets for improved electrical conductivity of polymer composites', Carbon, 45, pp. 744 - 750, http://dx.doi.org/10.1016/j.carbon.2006.11.031

Kim JK; Sham ML, 2007, 'Functionalization of Carbon Nanotube Surface via UV/O₃ Treatment', Solid State Phenomena, 121-123, pp. 1407 - 1410, http://dx.doi.org/10.4028/www.scientific.net/ssp.121-123.1407

Ma PC; Kim JK; Tang BZ, 2007, 'Functionalization of Multi-Walled Carbon Nanotubes Via UV/O₃ and Silane Treatments', Key Engineering Materials, 334-335, pp. 797 - 800, http://dx.doi.org/10.4028/www.scientific.net/kem.334-335.797

Siddiqui NA; Kim JK; Muzaffar F; Munir A, 2007, 'Self-Healing Glass Fibres with Carbon Nanotube-Epoxy Nanocomposite Coating', Key Engineering Materials, 334-335, pp. 805 - 808, http://dx.doi.org/10.4028/www.scientific.net/kem.334-335.805

Zhu HG; Woo RSC; Leung CKY; Kim JK, 2007, 'Wear Resistance of Organic Nanocomposites', Key Engineering Materials, 334-335, pp. 605 - 608, http://dx.doi.org/10.4028/www.scientific.net/kem.334-335.605

Gao B; Leung CKY; Kim JK, 2007, 'Failure diagrams of FRP strengthened RC beams', Composite Structures, 77, pp. 493 - 508, http://dx.doi.org/10.1016/j.compstruct.2005.08.003

Li J; Sham ML; Kim JK; Marom G, 2007, 'Morphology and properties of UV/ozone treated graphite nanoplatelet/epoxy nanocomposites', Composites Science and Technology, 67, pp. 296 - 305, http://dx.doi.org/10.1016/j.compscitech.2006.08.009

Siddiqui NA; Woo RSC; Kim JK; Leung CCK; Munir A, 2007, 'Mode I interlaminar fracture behavior and mechanical properties of CFRPs with nanoclay-filled epoxy matrix', Composites Part A: Applied Science and Manufacturing, 38, pp. 449 - 460, http://dx.doi.org/10.1016/j.compositesa.2006.03.001

Ma PC; Kim JK; Tang BZ, 2006, 'Functionalization of carbon nanotubes using a silane coupling agent', Carbon, 44, pp. 3232 - 3238, http://dx.doi.org/10.1016/j.carbon.2006.06.032

Gao B; Kim JK; Leung CKY, 2006, 'Effect of tapered FRP sheets on interlaminar fracture behaviour of FRP-concrete interface', Composites Part A: Applied Science and Manufacturing, 37, pp. 1605 - 1612, http://dx.doi.org/10.1016/j.compositesa.2005.10.010

Gao B; Kim JK; Leung CKY, 2006, 'Strengthening efficiency of taper ended FRP strips bonded to RC beams', Composites Science and Technology, 66, pp. 2257 - 2264, http://dx.doi.org/10.1016/j.compscitech.2005.12.002

Kim JK; Woo RSC; Hung PYP; Lebbai M, 2006, 'Adhesion performance of black oxide coated copper substrates: Effects of moisture sensitivity test', Surface and Coatings Technology, 201, pp. 320 - 328, http://dx.doi.org/10.1016/j.surfcoat.2005.11.121

Chan YH; Kim JK; Liu D; Liu PCK; Cheung YM; Ng MW, 2006, 'Comparative performance of gold wire bonding on rigid and flexible substrates', Journal of Materials Science: Materials in Electronics, 17, pp. 597 - 606, http://dx.doi.org/10.1007/s10854-006-0005-4

Gao B; Kim JK; Leung CKY, 2006, 'Optimization of tapered end design for FRP strips bonded to RC beams', Composites Science and Technology, 66, pp. 1266 - 1273, http://dx.doi.org/10.1016/j.compscitech.2005.10.026

Sham ML; Kim JK, 2006, 'Surface functionalities of multi-wall carbon nanotubes after UV/Ozone and TETA treatments', Carbon, 44, pp. 768 - 777, http://dx.doi.org/10.1016/j.carbon.2005.09.013

Kim JK; Siddiqui NA; Woo RSC; Leung CCK; Munir A, 2006, 'Carbon fibre-organoclay hybrid epoxy composites: Fracture behaviours and mechanical properties', Key Engineering Materials, 312, pp. 179 - 184, http://dx.doi.org/10.4028/0-87849-994-6.179

Ding Y; Kim JK; Tong P, 2006, 'Effects of bonding force on contact pressure and frictional energy in wire bonding', Microelectronics Reliability, 46, pp. 1101 - 1112

Zhang TY; Kim JK, 2006, 'Mechanics of Materials: Preface', Mechanics of Materials, 38, pp. 1 - 2, http://dx.doi.org/10.1016/j.mechmat.2005.07.001

Kim JK; Siddiqui NA; Woo RSC; Leung CKY; Munir A, 2006, 'Carbon Fibre-Organoclay Hybrid Epoxy Composites: Fracture Behaviours and Mechanical Properties', Key Engineering Materials, 312, pp. 179 - 186, http://dx.doi.org/10.4028/www.scientific.net/kem.312.179

Chan YH; Kim JK; Liu D; Liu PCK; Cheung YM; Ng MW, 2005, 'Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding', IEEE Transactions on Advanced Packaging, 28, pp. 674 - 684, http://dx.doi.org/10.1109/TADVP.2005.853548

Kim JK; Lebbai M; Lam YM; Hung PYP; Woo RSC, 2005, 'Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide substrate', Journal of Adhesion Science and Technology, 19, pp. 427 - 444, http://dx.doi.org/10.1163/1568561054352568

Li J; Kim JK; Lung Sham M, 2005, 'Conductive graphite nanoplatelet/epoxy nanocomposites: Effects of exfoliation and UV/ozone treatment of graphite', Scripta Materialia, 53, pp. 235 - 240, http://dx.doi.org/10.1016/j.scriptamat.2005.03.034

Lai M; Kim JK, 2005, 'Effects of epoxy treatment of organoclay on structure, thermo-mechanical and transport properties of poly(ethylene terephthalate-co-ethylene naphthalate)/organoclay nanocomposites', Polymer, 46, pp. 4722 - 4734, http://dx.doi.org/10.1016/j.polymer.2005.03.062

Sham ML; Kim JK, 2005, 'Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages', Journal of Applied Polymer Science, 96, pp. 175 - 182, http://dx.doi.org/10.1002/app.21384

Kim JK; Sham ML; Sohn MS; Hu S, 2005, 'Effects of fibre surface treatment on dynamic tensile properties of glass woven fabric reinforced vinylester composites', Polymers and Polymer Composites, 13, pp. 453 - 466, http://dx.doi.org/10.1177/096739110501300503

Kim JK; Lebbai M; Woo RSC, 2005, 'Effects of hygrothermal ageing and thermal shock on reliability of interfacial adhesion between black oxide coated copper substrate and epoxy resin', Composite Interfaces, 12, pp. 739 - 756, http://dx.doi.org/10.1163/156855405774984020

Sham ML; Kim JK, 2005, 'Experiment and numerical analysis of the residual stresses in underfill resins for flip chip package applications', Journal of Electronic Packaging, 127, pp. 47 - 51, http://dx.doi.org/10.1115/1.1849232

Zhang TY; Kim JK, 2005, 'Guest editorial', Composites Science and Technology, 65, pp. 1325, http://dx.doi.org/10.1016/j.compscitech.2004.12.001

Kim JK; Hu C; Woo RSC; Sham ML, 2005, 'Moisture barrier characteristics of organoclay-epoxy nanocomposites', Composites Science and Technology, 65, pp. 805 - 813, http://dx.doi.org/10.1016/j.compscitech.2004.10.014

Gao B; Leung CKY; Kim JK, 2005, 'Prediction of concrete cover separation failure for RC beams strengthened with CFRP strips', Engineering Structures, 27, pp. 177 - 189, http://dx.doi.org/10.1016/j.engstruct.2004.09.007

Ding Y; Xue M; Kim JK, 2005, 'Thermo-structural analysis of space structures using Fourier tube elements', Computational Mechanics, 36, pp. 289 - 297, http://dx.doi.org/10.1007/s00466-005-0666-5

Gao B; Kim JK; Leung CKY, 2004, 'Experimental study on RC beams with FRP strips bonded with rubber modified resins', Composites Science and Technology, 64, pp. 2557 - 2564, http://dx.doi.org/10.1016/j.compscitech.2004.05.016

Hodzic A; Kim JK; Lowe AE; Stachurski ZH, 2004, 'The effects of water aging on the interphase region and interlaminar fracture toughness in polymer-glass composites', Composites Science and Technology, 64, pp. 2185 - 2195, http://dx.doi.org/10.1016/j.compscitech.2004.03.011

Lebbai M; Kim JK; Szeto WK; Wu J, 2004, 'Surface characterization and adhesion of black-oxide-coated copper substrate: Effect of surface hardening processes', Journal of Adhesion Science and Technology, 18, pp. 983 - 1001, http://dx.doi.org/10.1163/1568561041257513

Sham ML; Kim JK, 2004, 'Evolution of residual stresses in modified epoxy resins for electronic packaging applications', Composites Part A: Applied Science and Manufacturing, 35, pp. 537 - 546, http://dx.doi.org/10.1016/j.compositesa.2004.01.002

Sham MLI; Kim JK, 2004, 'Improved underfill adhesion in flip-chip packages by means of ultraviolet light/ozone treatment', IEEE Transactions on Advanced Packaging, 27, pp. 179 - 187, http://dx.doi.org/10.1109/TADVP.2004.825452

Chan YH; Kim JK; Liu D; Liu PCK; Cheung YM; Ng MW, 2004, 'Process windows for low-temperature Au wire bonding', Journal of Electronic Materials, 33, pp. 146 - 155, http://dx.doi.org/10.1007/s11664-004-0285-5

Sham ML; Kim JK, 2003, 'Adhesion characteristics of underfill resins with flip chip package components', Journal of Adhesion Science and Technology, 17, pp. 1923 - 1944, http://dx.doi.org/10.1163/156856103770572052

Lebbai M; Kim JK; Szeto WK, 2003, 'Surface characteristics and adhesion performance of black oxide coated copper substrates with epoxy resins', Journal of Adhesion Science and Technology, 17, pp. 1543 - 1560, http://dx.doi.org/10.1163/156856103769207392

Kim JK; Hodzic A, 2003, 'Nanoscale characterisation of thickness and properties of interphase in polymer matrix composites', Journal of Adhesion, 79, pp. 383 - 414, http://dx.doi.org/10.1080/00218460309585

Kong JWY; Kim JK; Yuen MMF, 2003, 'Warpage in plastic packages: Effects of process conditions, geometry and materials', IEEE Transactions on Electronics Packaging Manufacturing, 26, pp. 245 - 252, http://dx.doi.org/10.1109/TEPM.2003.820806

Gao B; Kim JK; Leung CKY, 2003, 'Effect of rubber modifier on interlaminar fracture toughness of CFRP-concrete interface', Composites Science and Technology, 63, pp. 883 - 892, http://dx.doi.org/10.1016/S0266-3538(02)00311-1

Dai Y; Kim JK; Park J, 2003, 'Numerical study of the single fibre push-out test: Part III. Singularity of interface stresses', Composite Interfaces, 10, pp. 17 - 39, http://dx.doi.org/10.1163/156855403763586774

Lebbai M; Kim JK; Yuen MMF, 2003, 'Effects of dimple and metal coating on interfacial adhesion in plastic packages', Journal of Electronic Materials, 32, pp. 564 - 573, http://dx.doi.org/10.1007/s11664-003-0143-x

Lebbai M; Kim JK; Yuen MMF, 2003, 'Effects of moisture and elevated temperature on reliability of interfacial adhesion in plastic packages', Journal of Electronic Materials, 32, pp. 574 - 582, http://dx.doi.org/10.1007/s11664-003-0144-9

Lebbai M; Kim JK; Szeto WK; Yuen MMF; Tong P, 2003, 'Optimization of black oxide coating thickness as an adhesion promoter for copper substrate in plastic integrated-circuit packages', Journal of Electronic Materials, 32, pp. 558 - 563, http://dx.doi.org/10.1007/s11664-003-0142-y

Gao SL; Kim JK, 2002, 'Correlation among crystalline morphology of PEEK, interface bond strength, and in-plane mechanical properties of carbon/PEEK composites', Journal of Applied Polymer Science, 84, pp. 1155 - 1167, http://dx.doi.org/10.1002/app.10406

Kim JK; Sham ML; Hamada H; Hirai Y; Fujihara K; Saidpour H; Sezen M; Krawczak P; Bequignat R; Pabiot J; Pinter S; Banhegyl G; Yue CY; Padmanabhan K; Suzuki Y; Schulte K; Karger-Kocsis JK; Ye L; Lesko JJ, 2002, 'Effects of surface treatment and weave structure on interlaminar fracture behaviour of plain glass woven fabric composites: Part II. Report of the 2nd round robin test results', Composite Interfaces, 9, pp. 207 - 218, http://dx.doi.org/10.1163/156855402760116102

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