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Patents

Ciesla A; Hallam B; Chan C; Chong C; Chen D; Bagnall D; Payne D; Mai L; Abbott M; Kim M; Chen R; Wenham S; Fung T; Shi Z, 2021, A method for improving wafer performance for photovoltaic devices, Patent No. US pat no. 10910509

Ciesla A; Wenham S; Hallam B; Chan C; Chong CM; Chen R; Abbott M; Payne D, 2019, A method for processing silicon material, Patent No. 10461212; Chine 2021 pat no. ZL201680015469.X, http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=10461212.PN.&OS=PN/10461212&RS=PN/10461212


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