By Dr Hoang-Phuong Phan

Journal articles

Phan HP; Nguyen TK; Dinh T; Cheng HH; Mu F; Iacopi A; Hold L; Dao DV; Suga T; Senesky DG; Nguyen NT, 2018, 'Strain Effect in Highly-Doped n-Type 3C-SiC-on-Glass Substrate for Mechanical Sensors and Mobility Enhancement', Physica Status Solidi (A) Applications and Materials Science, 215, http://dx.doi.org/10.1002/pssa.201800288

Lenzini F; Janousek J; Thearle O; Villa M; Haylock B; Kasture S; Cui L; Phan HP; Dao DV; Yonezawa H; Lam PK; Huntington EH; Lobino M, 2018, 'Integrated photonic platform for quantum information with continuous variables', Science Advances, 4, http://dx.doi.org/10.1126/sciadv.aat9331

Dinh T; Phan HP; Kashaninejad N; Nguyen TK; Dao DV; Nguyen NT, 2018, 'An On-Chip SiC MEMS Device with Integrated Heating, Sensing, and Microfluidic Cooling Systems', Advanced Materials Interfaces, 5, http://dx.doi.org/10.1002/admi.201800764

Nguyen TK; Phan HP; Dinh T; Dowling KM; Foisal ARM; Senesky DG; Nguyen NT; Dao DV, 2018, 'Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures', Materials and Design, 156, pp. 441 - 445, http://dx.doi.org/10.1016/j.matdes.2018.07.014

Phan HP; Dowling KM; Nguyen TK; Dinh T; Senesky DG; Namazu T; Dao DV; Nguyen NT, 2018, 'Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure', Materials and Design, 156, pp. 16 - 21, http://dx.doi.org/10.1016/j.matdes.2018.06.031

Fastier-Wooller J; Dinh T; Dau VT; Phan HP; Yang F; Dao DV, 2018, 'Low-cost graphite on paper pressure sensor for a robot gripper with a trivial fabrication process', Sensors (Switzerland), 18, http://dx.doi.org/10.3390/s18103300

Vatani A; Woodfield PL; Dinh T; Phan HP; Nguyen NT; Dao DV, 2018, 'Degraded boiling heat transfer from hotwire in ferrofluid due to particle deposition', Applied Thermal Engineering, 142, pp. 255 - 261, http://dx.doi.org/10.1016/j.applthermaleng.2018.06.064

Balakrishnan V; Dinh T; Phan HP; Dao DV; Nguyen NT, 2018, 'Highly sensitive 3C-SiC on glass based thermal flow sensor realized using MEMS technology', Sensors and Actuators, A: Physical, 279, pp. 293 - 305, http://dx.doi.org/10.1016/j.sna.2018.06.025

Md Foisal AR; Dinh T; Tanner P; Phan HP; Nguyen TK; Streed EW; Dao DV, 2018, 'Photoresponse of a Highly-Rectifying 3C-SiC/Si Heterostructure Under UV and Visible Illuminations', IEEE Electron Device Letters, 39, pp. 1219 - 1222, http://dx.doi.org/10.1109/LED.2018.2850757

Islam MN; Moriam S; Umer M; Phan HP; Salomon C; Kline R; Nguyen NT; Shiddiky MJA, 2018, 'Naked-eye and electrochemical detection of isothermally amplified HOTAIR long non-coding RNA', Analyst, 143, pp. 3021 - 3028, http://dx.doi.org/10.1039/c7an02109g

Nguyen TK; Phan HP; Dinh T; Toriyama T; Nakamura K; Foisal ARM; Nguyen NT; Dao DV, 2018, 'Isotropic piezoresistance of p-type 4H-SiC in (0001) plane', Applied Physics Letters, 113, http://dx.doi.org/10.1063/1.5037545

Balakrishnan V; Dinh T; Phan HP; Dao DV; Nguyen NT, 2018, 'A Generalized Analytical Model for Joule Heating of Segmented Wires', Journal of Heat Transfer, 140, http://dx.doi.org/10.1115/1.4038829

Dinh T; Nguyen TK; Phan HP; Fastier-Wooller J; Tran CD; Nguyen NT; Dao DV, 2018, 'Electrical Resistance of Carbon Nanotube Yarns under Compressive Transverse Pressure', IEEE Electron Device Letters, 39, pp. 584 - 587, http://dx.doi.org/10.1109/LED.2018.2806181

Dinh T; Phan HP; Nguyen TK; Balakrishnan V; Cheng HH; Hold L; Lacopi A; Nguyen NT; Dao DV, 2018, 'Unintentionally Doped Epitaxial 3C-SiC(111) Nanothin Film as Material for Highly Sensitive Thermal Sensors at High Temperatures', IEEE Electron Device Letters, 39, pp. 580 - 583, http://dx.doi.org/10.1109/LED.2018.2808329

Md Foisal AR; Phan HP; Dinh T; Nguyen TK; Nguyen NT; Dao DV, 2018, 'A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding', RSC Advances, 8, pp. 15310 - 15314, http://dx.doi.org/10.1039/c8ra00734a

Phan HP; Dowling KM; Nguyen TK; Chapin CA; Dinh T; Miller RA; Han J; Iacopi A; Senesky DG; Dao DV; Nguyen NT, 2018, 'Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures', RSC Advances, 8, pp. 29976 - 29979, http://dx.doi.org/10.1039/c8ra05797d

Nguyen TK; Phan HP; Dinh T; Md Foisal AR; Nguyen NT; Dao DV, 2018, 'High-temperature tolerance of the piezoresistive effect in p-4H-SiC for harsh environment sensing', Journal of Materials Chemistry C, 6, pp. 8613 - 8617, http://dx.doi.org/10.1039/c8tc03094d

Nguyen TK; Phan HP; Han J; Dinh T; Md Foisal AR; Dimitrijev S; Zhu Y; Nguyen NT; Dao DV, 2018, 'Highly sensitive p-Type 4H-SiC van der Pauw sensor', RSC Advances, 8, pp. 3009 - 3013, http://dx.doi.org/10.1039/c7ra11922d

Phan HP; Nguyen TK; Dinh T; Iacopi A; Hold L; Shiddiky MJA; Dao DV; Nguyen NT, 2018, 'Robust Free-Standing Nano-Thin SiC Membranes Enable Direct Photolithography for MEMS Sensing Applications', Advanced Engineering Materials, 20, http://dx.doi.org/10.1002/adem.201700858

Phan H; Nguyen T; Dinh T; Cheng H; Mu F; Iacopi A; Hold L; Dao DV; Suga T; Senesky DG; Nguyen N, 2018, 'Strain Effect in Highly‐Doped n‐Type 3C‐SiC‐on‐Glass Substrate for Mechanical Sensors and Mobility Enhancement (Phys. Status Solidi A 24∕2018)', physica status solidi (a), 215, http://dx.doi.org/10.1002/pssa.201870054

Nguyen TK; Phan HP; Kamble H; Vadivelu R; Dinh T; Iacopi A; Walker G; Hold L; Nguyen NT; Dao DV, 2017, 'Superior Robust Ultrathin Single-Crystalline Silicon Carbide Membrane as a Versatile Platform for Biological Applications', ACS Applied Materials and Interfaces, 9, pp. 41641 - 41647, http://dx.doi.org/10.1021/acsami.7b15381

Tanner P; Iacopi A; Phan HP; Dimitrijev S; Hold L; Chaik K; Walker G; Dao DV; Nguyen NT, 2017, 'Excellent Rectifying Properties of the n-3C-SiC/p-Si Heterojunction Subjected to High Temperature Annealing for Electronics, MEMS, and LED Applications', Scientific Reports, 7, http://dx.doi.org/10.1038/s41598-017-17985-9

Md Foisal AR; Qamar A; Phan HP; Dinh T; Tuan KN; Tanner P; Streed EW; Dao DV, 2017, 'Pushing the Limits of Piezoresistive Effect by Optomechanical Coupling in 3C-SiC/Si Heterostructure', ACS Applied Materials and Interfaces, 9, pp. 39921 - 39925, http://dx.doi.org/10.1021/acsami.7b12128

Dinh T; Phan HP; Qamar A; Woodfield P; Nguyen NT; Dao DV, 2017, 'Thermoresistive Effect for Advanced Thermal Sensors: Fundamentals, Design Considerations, and Applications', Journal of Microelectromechanical Systems, 26, pp. 966 - 986, http://dx.doi.org/10.1109/JMEMS.2017.2710354

Balakrishnan V; Phan HP; Dinh T; Dao DV; Nguyen NT, 2017, 'Thermal flow sensors for harsh environments', Sensors (Switzerland), 17, http://dx.doi.org/10.3390/s17092061

Fiondella L; Lin Y-K; Phan H; Chang P-C; Li C, 2017, 'A confidence-based approach to reliability design considering correlated failures', RELIABILITY ENGINEERING & SYSTEM SAFETY, 165, pp. 102 - 114, http://dx.doi.org/10.1016/j.ress.2017.03.025

Nguyen TK; Dinh T; Phan HP; Tran CD; Foisal ARM; Zhu Y; Dao DV, 2017, 'Electrically Stable Carbon Nanotube Yarn under Tensile Strain', IEEE Electron Device Letters, 38, pp. 1331 - 1334, http://dx.doi.org/10.1109/LED.2017.2726016

Phan HP; Cheng HH; Dinh T; Wood B; Nguyen TK; Mu F; Kamble H; Vadivelu R; Walker G; Hold L; Iacopi A; Haylock B; Dao DV; Lobino M; Suga T; Nguyen NT, 2017, 'Single-Crystalline 3C-SiC anodically Bonded onto Glass: An Excellent Platform for High-Temperature Electronics and Bioapplications', ACS Applied Materials and Interfaces, 9, pp. 27365 - 27371, http://dx.doi.org/10.1021/acsami.7b06661

Nguyen TK; Phan HP; Dinh T; Han J; Dimitrijev S; Tanner P; Foisal ARM; Zhu Y; Nguyen NT; Dao DV, 2017, 'Experimental investigation of piezoresistive effect in p-Type 4H-SiC', IEEE Electron Device Letters, 38, pp. 955 - 958, http://dx.doi.org/10.1109/LED.2017.2700402

Balakrishnan V; Dinh T; Phan HP; Kozeki T; Namazu T; Dao DV; Nguyen NT, 2017, 'Steady-state analytical model of suspended p-type 3C-SiC bridges under consideration of Joule heating', Journal of Micromechanics and Microengineering, 27, http://dx.doi.org/10.1088/1361-6439/aa7180

Phan HP; Ina G; Dinh T; Kozeki T; Nguyen TK; Namazu T; Qamar A; Dao DV; Nguyen NT, 2017, 'Formation of silicon carbide nanowire on insulator through direct wet oxidation', Materials Letters, 196, pp. 280 - 283, http://dx.doi.org/10.1016/j.matlet.2017.03.118

Dinh T; Phan HP; Nguyen TK; Qamar A; Woodfield P; Zhu Y; Nguyen NT; Viet Dao D, 2017, 'Solvent-free fabrication of biodegradable hot-film flow sensor for noninvasive respiratory monitoring', Journal of Physics D: Applied Physics, 50, http://dx.doi.org/10.1088/1361-6463/aa6cd6

Lenzini F; Haylock B; Loredo JC; Abrahão RA; Zakaria NA; Kasture S; Sagnes I; Lemaitre A; Phan HP; Dao DV; Senellart P; Almeida MP; White AG; Lobino M, 2017, 'Active demultiplexing of single photons from a solid-state source', Laser and Photonics Reviews, 11, http://dx.doi.org/10.1002/lpor.201600297

Qamar A; Sarwar T; Dinh T; Foisal ARM; Phan HP; Dao DV, 2017, 'Pseudo-Hall Effect in Graphite on Paper Based Four Terminal Devices for Stress Sensing Applications', Journal of Physics: Conference Series, 829, http://dx.doi.org/10.1088/1742-6596/829/1/012004

Qamar A; Dao DV; Dinh T; Iacopi A; Walker G; Phan HP; Hold L; Dimitrijev S, 2017, 'Piezo-Hall effect and fundamental piezo-Hall coefficients of single crystal n-type 3C-SiC(100) with low carrier concentration', Applied Physics Letters, 110, http://dx.doi.org/10.1063/1.4980849

Phan HP; Dinh T; Nguyen TK; Vatani A; Md Foisal AR; Qamar A; Kermany AR; Dao DV; Nguyen NT, 2017, 'Self-sensing paper-based actuators employing ferromagnetic nanoparticles and graphite', Applied Physics Letters, 110, http://dx.doi.org/10.1063/1.4979701

Phan HP; Nguyen TK; Dinh T; Ina G; Kermany AR; Qamar A; Han J; Namazu T; Maeda R; Dao DV; Nguyen NT, 2017, 'Ultra-high strain in epitaxial silicon carbide nanostructures utilizing residual stress amplification', Applied Physics Letters, 110, http://dx.doi.org/10.1063/1.4979834

Qamar A; Dao DV; Han J; Iacopi A; Dinh T; Phan HP; Dimitrijev S, 2017, 'Pseudo-hall effect in single crystal n-type 3C-SiC(100) thin film', Key Engineering Materials, 733 KEM, pp. 3 - 7, http://dx.doi.org/10.4028/www.scientific.net/KEM.733.3

Lenzini F; Haylock B; Loredo JC; Abrahão RA; Zakaria NA; Kasture S; Sagnes I; Lemaitre A; Phan H; Dao DV; Senellart P; Almeida MP; White AG; Lobino M, 2017, 'Active demultiplexing of single photons from a solid‐state source (Laser Photonics Rev. 11(3)/2017)', Laser & Photonics Reviews, 11, http://dx.doi.org/10.1002/lpor.201770034

Phan HP; Dinh T; Kozeki T; Nguyen TK; Qamar A; Namazu T; Nguyen NT; Dao DV, 2016, 'Nano strain-amplifier: Making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects', Applied Physics Letters, 109, http://dx.doi.org/10.1063/1.4963258

Qamar A; Dao DV; Phan HP; Dinh T; Dimitrijev S, 2016, 'Fundamental piezo-Hall coefficients of single crystal p-type 3C-SiC for arbitrary crystallographic orientation', Applied Physics Letters, 109, http://dx.doi.org/10.1063/1.4962048

Dinh T; Phan HP; Kozeki T; Qamar A; Fujii T; Namazu T; Nguyen NT; Dao DV, 2016, 'High thermosensitivity of silicon nanowires induced by amorphization', Materials Letters, 177, pp. 80 - 84, http://dx.doi.org/10.1016/j.matlet.2016.04.171

Fastier-Wooller J; Phan HP; Dinh T; Nguyen TK; Cameron A; Öchsner A; Dao DV, 2016, 'Novel low-cost sensor for human bite force measurement', Sensors (Switzerland), 16, http://dx.doi.org/10.3390/s16081244

Phan HP; Dinh T; Kozeki T; Nguyen TK; Qamar A; Namazu T; Nguyen NT; Dao DV, 2016, 'The Piezoresistive Effect in Top-Down Fabricated p-Type 3C-SiC Nanowires', IEEE Electron Device Letters, 37, pp. 1029 - 1032, http://dx.doi.org/10.1109/LED.2016.2579020

Phan HP; Dinh T; Kozeki T; Qamar A; Namazu T; Dimitrijev S; Nguyen NT; Dao DV, 2016, 'Piezoresistive effect in p-Type 3C-SiC at high temperatures characterized using Joule heating', Scientific Reports, 6, http://dx.doi.org/10.1038/srep28499

Kozeki T; Phan HP; Dao DV; Inoue S; Namazu T, 2016, 'Influence of gallium ion beam acceleration voltage on the bend angle of amorphous silicon cantilevers', Japanese Journal of Applied Physics, 55, http://dx.doi.org/10.7567/JJAP.55.06GL02

Md Foisal AR; Phan HP; Kozeki T; Dinh T; Tuan KN; Qamar A; Lobino M; Namazu T; Dao DV, 2016, '3C-SiC on glass: An ideal platform for temperature sensors under visible light illumination', RSC Advances, 6, pp. 87124 - 87127, http://dx.doi.org/10.1039/c6ra19418d

Dinh T; Phan HP; Nguyen TK; Qamar A; Foisal ARM; Nguyen Viet T; Tran CD; Zhu Y; Nguyen NT; Dao DV, 2016, 'Environment-friendly carbon nanotube based flexible electronics for noninvasive and wearable healthcare', Journal of Materials Chemistry C, 4, pp. 10061 - 10068, http://dx.doi.org/10.1039/c6tc02708c

Dinh T; Phan HP; Qamar A; Nguyen NT; Dao DV, 2016, 'Flexible and multifunctional electronics fabricated by a solvent-free and user-friendly method', RSC Advances, 6, pp. 77267 - 77274, http://dx.doi.org/10.1039/c6ra14646e

Qamar A; Phan HP; Dinh T; Wang L; Dimitrijev S; Dao DV, 2016, 'Piezo-Hall effect in single crystal p-type 3C-SiC(100) thin film grown by low pressure chemical vapor deposition', RSC Advances, 6, pp. 31191 - 31195, http://dx.doi.org/10.1039/c6ra04501d

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