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By Professor Bram Hoex

Conference Posters

Varshney U; Liu S; Chen D; Kim M; Abbott M; Payne D; Hoex B; Chan C; Wenham S; Sen C, 2018, 'Influence of dielectric passivation layer thickness on LeTID in multicrystalline silicon', Hawaii, USA, Vol. 00, pp. 363 - 367, presented at WCPEC-7, Hawaii, USA, 10 June 2018 - 15 June 2018, http://dx.doi.org/10.1109/PVSC.2018.8547618


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ORCID as entered in ROS

orcid_icon https://orcid.org/0000-0002-2723-5286

UNSW Sydney NSW 2052 Australia Telephone +61 2 93851000
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UNSW CRICOS Provider Code: 00098G ABN: 57 195 873 179

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