By Professor Jang-Kyo Kim

Conference Papers

Sham ML; Kim JK; Park JH, 2003, 'Viscoelastic properties of underfill for numerical analysis of flip chip packages', in Proceedings - Electronic Components and Technology Conference, pp. 560 - 566

Tsui YK; Lee SWR; Wu JS; Kim JK; Yuen MMF, 2003, 'Three-dimensional packaging for multi-chip module with through-the-silicon via hole', in Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003, pp. 1 - 7, http://dx.doi.org/10.1109/EPTC.2003.1271480

Lebbai M; Lam OYM; Kim JK, 2002, 'Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide surface', in 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2002 - Conference Proceedings, pp. 54 - 62, http://dx.doi.org/10.1109/POLYTR.2002.1020183

Park J; Dai Y; Kim JK, 2002, 'Singularity of interface stresses in fibre push-out test', in Key Engineering Materials, pp. 7 - 16

Chan YH; Kim JK; Liu D; Liu CK; Cheung YM; Ng MW, 2002, 'Wire bondability of Au/Ni bond pads: Effects of metallisation schemes and processing conditions', in Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, pp. 69 - 76, http://dx.doi.org/10.1109/EMAP.2002.1188815

Sham ML; Kim JK, 2001, 'Measurement of residual stresses in flip chip underfill resins', in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics, pp. 160 - 167

Sham ML; Lam M; Kim JK, 2001, 'Adhesion characteristics of underfill material with various package components after plasma and UV/ozone treatments', in Advances in Electronic Materials and Packaging 2001, pp. 208 - 215, http://dx.doi.org/10.1109/EMAP.2001.983986

Szeto WK; Chum CC; Kim JK; Sze A; Cheung YM, 2001, 'Feasibility and characterization study of Al and Au wire bonding on immersion Ag and Sn coatings', in Advances in Electronic Materials and Packaging 2001, pp. 56 - 62, http://dx.doi.org/10.1109/EMAP.2001.983958

Lebbai M; Kim JK; Yuen MMF; Tong P, 2000, 'Effect of black copper oxide on interface adhesion between copper substrate and glob-top resin', in 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000, pp. 61 - 69, http://dx.doi.org/10.1109/ADHES.2000.860575

Sham ML; Kim JK, 2000, 'Effects of flux residue and thermomechanical stresses on delamination failure in flip chip packages', in International Symposium on Electronic Materials and Packaging, EMAP 2000, pp. 274 - 281, http://dx.doi.org/10.1109/EMAP.2000.904167

Szeto WK; Xie MY; Kim JK; Yuen MMF; Tong P; Yi S, 2000, 'Interface failure criterion of button shear test as a means of interface adhesion measurement in plastic packages', in International Symposium on Electronic Materials and Packaging, EMAP 2000, pp. 263 - 268, http://dx.doi.org/10.1109/EMAP.2000.904165

Lebbai M; Szeto WK; Kim JK, 2000, 'Optimization of black oxide coating thickness as adhesion promoter for copper substrate', in International Symposium on Electronic Materials and Packaging, EMAP 2000, pp. 206 - 213, http://dx.doi.org/10.1109/EMAP.2000.904156

Tong P; Lam DCC; Yuen MMF; Kim JK; Lee RSW; Lee SHK; Chan P, 1999, 'Global collaborative electronic packaging education', in Proceedings - Electronic Components and Technology Conference, pp. 907 - 911

Dai Y; Kim JK; Ji X; Xue ST, 1998, 'An Analysis of Singularity in Single Fibre Pull-Out Test Using BEM', in Key Engineering Materials, pp. 595 - 600

Baillie C; Kim JK; Mai YW, 1993, 'Comparison of two single fibre interface tests', in Proceedings of the International Conference on Advanced Composite Materials, pp. 715 - 721

Kim JK; Mai YW, 1993, 'Optimization of toughness and strength properties in fibre composites with controlled interfaces', in Proceedings of the International Conference on Advanced Composite Materials, pp. 69 - 77

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