By Professor Jang-Kyo Kim

Journal articles

Kim JK; Siddiqui NA; Woo RSC; Leung CCK; Munir A, 2006, 'Carbon fibre-organoclay hybrid epoxy composites: Fracture behaviours and mechanical properties', Key Engineering Materials, 312, pp. 179 - 184, http://dx.doi.org/10.4028/0-87849-994-6.179

Ding Y; Kim JK; Tong P, 2006, 'Effects of bonding force on contact pressure and frictional energy in wire bonding', Microelectronics Reliability, 46, pp. 1101 - 1112

Zhang TY; Kim JK, 2006, 'Mechanics of Materials: Preface', Mechanics of Materials, 38, pp. 1 - 2, http://dx.doi.org/10.1016/j.mechmat.2005.07.001

Kim JK; Siddiqui NA; Woo RSC; Leung CKY; Munir A, 2006, 'Carbon Fibre-Organoclay Hybrid Epoxy Composites: Fracture Behaviours and Mechanical Properties', Key Engineering Materials, 312, pp. 179 - 186, http://dx.doi.org/10.4028/www.scientific.net/kem.312.179

Chan YH; Kim JK; Liu D; Liu PCK; Cheung YM; Ng MW, 2005, 'Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding', IEEE Transactions on Advanced Packaging, 28, pp. 674 - 684, http://dx.doi.org/10.1109/TADVP.2005.853548

Kim JK; Lebbai M; Lam YM; Hung PYP; Woo RSC, 2005, 'Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide substrate', Journal of Adhesion Science and Technology, 19, pp. 427 - 444, http://dx.doi.org/10.1163/1568561054352568

Li J; Kim JK; Lung Sham M, 2005, 'Conductive graphite nanoplatelet/epoxy nanocomposites: Effects of exfoliation and UV/ozone treatment of graphite', Scripta Materialia, 53, pp. 235 - 240, http://dx.doi.org/10.1016/j.scriptamat.2005.03.034

Lai M; Kim JK, 2005, 'Effects of epoxy treatment of organoclay on structure, thermo-mechanical and transport properties of poly(ethylene terephthalate-co-ethylene naphthalate)/organoclay nanocomposites', Polymer, 46, pp. 4722 - 4734, http://dx.doi.org/10.1016/j.polymer.2005.03.062

Sham ML; Kim JK, 2005, 'Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages', Journal of Applied Polymer Science, 96, pp. 175 - 182, http://dx.doi.org/10.1002/app.21384

Kim JK; Sham ML; Sohn MS; Hu S, 2005, 'Effects of fibre surface treatment on dynamic tensile properties of glass woven fabric reinforced vinylester composites', Polymers and Polymer Composites, 13, pp. 453 - 466, http://dx.doi.org/10.1177/096739110501300503

Kim JK; Lebbai M; Woo RSC, 2005, 'Effects of hygrothermal ageing and thermal shock on reliability of interfacial adhesion between black oxide coated copper substrate and epoxy resin', Composite Interfaces, 12, pp. 739 - 756, http://dx.doi.org/10.1163/156855405774984020

Sham ML; Kim JK, 2005, 'Experiment and numerical analysis of the residual stresses in underfill resins for flip chip package applications', Journal of Electronic Packaging, 127, pp. 47 - 51, http://dx.doi.org/10.1115/1.1849232

Zhang TY; Kim JK, 2005, 'Guest editorial', Composites Science and Technology, 65, pp. 1325, http://dx.doi.org/10.1016/j.compscitech.2004.12.001

Kim JK; Hu C; Woo RSC; Sham ML, 2005, 'Moisture barrier characteristics of organoclay-epoxy nanocomposites', Composites Science and Technology, 65, pp. 805 - 813, http://dx.doi.org/10.1016/j.compscitech.2004.10.014

Gao B; Leung CKY; Kim JK, 2005, 'Prediction of concrete cover separation failure for RC beams strengthened with CFRP strips', Engineering Structures, 27, pp. 177 - 189, http://dx.doi.org/10.1016/j.engstruct.2004.09.007

Ding Y; Xue M; Kim JK, 2005, 'Thermo-structural analysis of space structures using Fourier tube elements', Computational Mechanics, 36, pp. 289 - 297, http://dx.doi.org/10.1007/s00466-005-0666-5

Gao B; Kim JK; Leung CKY, 2004, 'Experimental study on RC beams with FRP strips bonded with rubber modified resins', Composites Science and Technology, 64, pp. 2557 - 2564, http://dx.doi.org/10.1016/j.compscitech.2004.05.016

Hodzic A; Kim JK; Lowe AE; Stachurski ZH, 2004, 'The effects of water aging on the interphase region and interlaminar fracture toughness in polymer-glass composites', Composites Science and Technology, 64, pp. 2185 - 2195, http://dx.doi.org/10.1016/j.compscitech.2004.03.011

Lebbai M; Kim JK; Szeto WK; Wu J, 2004, 'Surface characterization and adhesion of black-oxide-coated copper substrate: Effect of surface hardening processes', Journal of Adhesion Science and Technology, 18, pp. 983 - 1001, http://dx.doi.org/10.1163/1568561041257513

Sham ML; Kim JK, 2004, 'Evolution of residual stresses in modified epoxy resins for electronic packaging applications', Composites Part A: Applied Science and Manufacturing, 35, pp. 537 - 546, http://dx.doi.org/10.1016/j.compositesa.2004.01.002

Sham MLI; Kim JK, 2004, 'Improved underfill adhesion in flip-chip packages by means of ultraviolet light/ozone treatment', IEEE Transactions on Advanced Packaging, 27, pp. 179 - 187, http://dx.doi.org/10.1109/TADVP.2004.825452

Chan YH; Kim JK; Liu D; Liu PCK; Cheung YM; Ng MW, 2004, 'Process windows for low-temperature Au wire bonding', Journal of Electronic Materials, 33, pp. 146 - 155, http://dx.doi.org/10.1007/s11664-004-0285-5

Sham ML; Kim JK, 2003, 'Adhesion characteristics of underfill resins with flip chip package components', Journal of Adhesion Science and Technology, 17, pp. 1923 - 1944, http://dx.doi.org/10.1163/156856103770572052

Lebbai M; Kim JK; Szeto WK, 2003, 'Surface characteristics and adhesion performance of black oxide coated copper substrates with epoxy resins', Journal of Adhesion Science and Technology, 17, pp. 1543 - 1560, http://dx.doi.org/10.1163/156856103769207392

Kim JK; Hodzic A, 2003, 'Nanoscale characterisation of thickness and properties of interphase in polymer matrix composites', Journal of Adhesion, 79, pp. 383 - 414, http://dx.doi.org/10.1080/00218460309585

Kong JWY; Kim JK; Yuen MMF, 2003, 'Warpage in plastic packages: Effects of process conditions, geometry and materials', IEEE Transactions on Electronics Packaging Manufacturing, 26, pp. 245 - 252, http://dx.doi.org/10.1109/TEPM.2003.820806

Gao B; Kim JK; Leung CKY, 2003, 'Effect of rubber modifier on interlaminar fracture toughness of CFRP-concrete interface', Composites Science and Technology, 63, pp. 883 - 892, http://dx.doi.org/10.1016/S0266-3538(02)00311-1

Dai Y; Kim JK; Park J, 2003, 'Numerical study of the single fibre push-out test: Part III. Singularity of interface stresses', Composite Interfaces, 10, pp. 17 - 39, http://dx.doi.org/10.1163/156855403763586774

Lebbai M; Kim JK; Yuen MMF, 2003, 'Effects of dimple and metal coating on interfacial adhesion in plastic packages', Journal of Electronic Materials, 32, pp. 564 - 573, http://dx.doi.org/10.1007/s11664-003-0143-x

Lebbai M; Kim JK; Yuen MMF, 2003, 'Effects of moisture and elevated temperature on reliability of interfacial adhesion in plastic packages', Journal of Electronic Materials, 32, pp. 574 - 582, http://dx.doi.org/10.1007/s11664-003-0144-9

Lebbai M; Kim JK; Szeto WK; Yuen MMF; Tong P, 2003, 'Optimization of black oxide coating thickness as an adhesion promoter for copper substrate in plastic integrated-circuit packages', Journal of Electronic Materials, 32, pp. 558 - 563, http://dx.doi.org/10.1007/s11664-003-0142-y

Gao SL; Kim JK, 2002, 'Correlation among crystalline morphology of PEEK, interface bond strength, and in-plane mechanical properties of carbon/PEEK composites', Journal of Applied Polymer Science, 84, pp. 1155 - 1167, http://dx.doi.org/10.1002/app.10406

Kim JK; Sham ML; Hamada H; Hirai Y; Fujihara K; Saidpour H; Sezen M; Krawczak P; Bequignat R; Pabiot J; Pinter S; Banhegyl G; Yue CY; Padmanabhan K; Suzuki Y; Schulte K; Karger-Kocsis JK; Ye L; Lesko JJ, 2002, 'Effects of surface treatment and weave structure on interlaminar fracture behaviour of plain glass woven fabric composites: Part II. Report of the 2nd round robin test results', Composite Interfaces, 9, pp. 207 - 218, http://dx.doi.org/10.1163/156855402760116102

Jiang W; Tsang FFY; Tjong SC; Li RKY; Kim JK; Mai YW, 2001, 'Loading rate dependence of mode II fracture behavior in interleaved carbon fibre/epoxy composite laminates', Applied Composite Materials, 8, pp. 361 - 369, http://dx.doi.org/10.1023/A:1012658114593

Kim JK; Huang XJ; Yu TXI; Chan CM; Guo BH, 2001, 'Interlaminar fracture behaviour of re-formed bamboo/aluminium sheet laminates', Journal of Adhesion Science and Technology, 15, pp. 535 - 552, http://dx.doi.org/10.1163/156856101300189916

Gao SL; Kim JK, 2001, 'Cooling rate influences in carbon fibre/PEEK composites. Part II: Interlaminar fracture toughness', Composites - Part A: Applied Science and Manufacturing, 32, pp. 763 - 774, http://dx.doi.org/10.1016/S1359-835X(00)00188-3

Gao SL; Kim JK, 2001, 'Cooling rate influences in carbon fibre/PEEK composites. Part III: Impact damage performance', Composites - Part A: Applied Science and Manufacturing, 32, pp. 775 - 785, http://dx.doi.org/10.1016/S1359-835X(00)00189-5

Kim JK; Sham ML; Sohn MS; Hamada H, 2001, 'Effect of hybrid layers with different silane coupling agents on impact response of glass fabric reinforced vinylester matrix composites', Polymer, 42, pp. 7455 - 7460, http://dx.doi.org/10.1016/S0032-3861(01)00246-4

Kim JK; Sham ML; Wu J, 2001, 'Nanoscale characterisation of interphase in silane treated glass fibre composites', Composites Part A: Applied Science and Manufacturing, 32, pp. 607 - 618, http://dx.doi.org/10.1016/S1359-835X(00)00163-9

Hodzic A; Stachurski ZH; Kim JK, 2001, 'Nano-indentation and nano-scratch of polymer/glass interfaces. II: Model of interphases in water aged composite materials', Polymer, 42, pp. 5701 - 5710, http://dx.doi.org/10.1016/S0032-3861(01)00029-5

Hodzic A; Stachurski ZH; Kim JK, 2001, 'An analysis of microdroplet test: Effects of specimen geometry, matrix type, fibre treatment and water ageing', Polymers and Polymer Composites, 9, pp. 499 - 508, http://dx.doi.org/10.1177/096739110100900802

Hodzic A; Kalyanasundaram S; Kim JK; Lowe AE; Stachurski ZH, 2001, 'Application of nano-indentation, nano-scratch and single fibre tests in investigation of interphases in composite materials', Micron, 32, pp. 765 - 775, http://dx.doi.org/10.1016/S0968-4328(00)00084-6

Kim WS; Kim JK; Hwang P, 2001, 'Characterization of nano-wear mechanisms of hard disk coatings', Journal of Electronic Materials, 30, pp. 503 - 512, http://dx.doi.org/10.1007/s11664-001-0090-3

Kim JK; Au BPL, 2001, 'Effects of metallization characteristics on gold wire bondability of organic printed circuit boards', Journal of Electronic Materials, 30, pp. 1001 - 1011, http://dx.doi.org/10.1007/BF02657725

Sohn MS; Hu XZ; Kim JK, 2001, 'Impact damage resistance of carbon fibre/epoxy composite laminates containing short Kevlar fibres', Polymers and Polymer Composites, 9, pp. 157 - 168, http://dx.doi.org/10.1177/096739110100900302

Jiang W; Tjong SC; Chu PK; Li RKY; Kim JK; Mai YW, 2001, 'Interlaminar fracture properties of carbon fibre/epoxy matrix composites interleaved with polyethylene terephthalate (PET) films', Polymers and Polymer Composites, 9, pp. 141 - 144, http://dx.doi.org/10.1177/096739110100900206

Zhang JY; Zeng QY; Yu TX; Kim JK, 2001, 'Residual properties of reformed bamboo/aluminium laminates after hygrothermal aging', Composites Science and Technology, 61, pp. 1041 - 1048, http://dx.doi.org/10.1016/S0266-3538(00)00232-3

Sohn MS; Hu XZ; Kim JK, 2000, 'Fractography of damaged carbon fiber/epoxy composites after low-velocity impact', Key Engineering Materials, 183

Kim JK; Sham ML; Hamada H; Hirai Y; Fujihara K; Saidpour H; Sezen M; Dong YJ; Yang HS; Bai YL; Mao TX; Bathias C; Hoa SV; Boutella A; Ngo AD; Krawczak P; Bequignat R; Pabiot J; Pinter S; Banhegyi G; Drzal LT; Ho H; Yue CY; Padmanabhan K; Suzuki Y; Tanimoto T; Schulte K; Karger-Kocsis JK; Cantwell WJ; Zulkitli R; Ye L; Lesko JJ; Garcia K, 2000, 'Effect of surface treatment on mode I interlaminar fracture behaviour of plain glass woven fabric composites: Part I. Report of the 2nd round-robin test results', Composite Interfaces, 7, pp. 227 - 242, http://dx.doi.org/10.1163/156855400300185333

Zhang JY; Yu TX; Kim JK; Sui GX, 2000, 'Static indentation and impact behaviour of reformed bamboo/aluminium laminated composites', Composite Structures, 50, pp. 207 - 216, http://dx.doi.org/10.1016/S0263-8223(00)00104-5

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