By Professor Jang-Kyo Kim

Conference Papers

Siddiqui NA; Li CY; Ma PC; Kim JK, 2009, 'Carbon nanotubes with dual wall structure; Properties and fracture behavior of epoxy nanocomposites', in ICCM International Conferences on Composite Materials

Siddiqui NA; Li CY; Yu Y; Ma PC; Kim JK, 2009, 'Prepregging and mechanical properties of CNT-CFRP hybrid composites', in ICCM International Conferences on Composite Materials

Khan SU; Iqbal K; Munir A; Kim JK, 2009, 'Quasi-static and impact fracture behaviors of CFRPs with nanoclay-filled epoxy matrix', in ICCM International Conferences on Composite Materials

Geng Y; Wang SJ; Li J; Kim JK, 2008, 'Preparation and characterization of amino functionalized graphite nanoplatelet', in Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008, pp. 52 - 55

Kosar I; Ullah KS; Kim JK; Munir A, 2008, 'Study on the low -velocity impact behavior of CFRP with nanoclay-filled epoxy matrix', in Advanced Materials Research, pp. 1205 - 1208, http://dx.doi.org/10.4028/www.scientific.net/amr.47-50.1205

Ma PC; Zhang H; Wang SQ; Wong YK; Tang BZ; Hong SH; Paik KW; Kim JK, 2007, 'Electrical conducting behavior of hybrid nanocomposites containing carbon nanotubes and carbon black', in EMAP 2007 - International Conference on Electronic Materials and Packaging 2007, http://dx.doi.org/10.1109/EMAP.2007.4510279

Ma PC; Zhang H; Wang SQ; Wong YK; Tang BZ; Hong SH; Paik K-W; Kim J-K, 2007, 'Electrical conducting behavior of hybrid nanocomposites containing carbon nanotubes and carbon black', in 2007 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, IEEE, SOUTH KOREA, Daejeon, pp. 22 - +, presented at International Conference on Electronic Materials and Packaging, SOUTH KOREA, Daejeon, 19 November 2007 - 22 November 2007

Kim JK; Sham ML, 2007, 'Functionalization of carbon nanotube surface Via UV/O3 treatment', in Solid State Phenomena, pp. 1407 - 1410, http://dx.doi.org/10.4028/3-908451-30-2.1407

Ma PC; Kim JK; Tang BZ, 2007, 'Functionalization of multi-walled carbon nanotubes via UV/O3 and silane treatments', in Key Engineering Materials, pp. 797 - 800, http://dx.doi.org/10.4028/0-87849-427-8.797

Li J; Ma PC; Sze CW; Kai TC; Tang BZ; Kim JK, 2007, 'Percolation threshold of polymer nanocomposites containing graphite nanoplatelets and carbon nanotubes', in ICCM International Conferences on Composite Materials

Siddiqui NA; Kim JK; Muzaffar F; Munir A, 2007, 'Self-healing glass fibres with carbon nanotube-epoxy nanocomposite coating', in Key Engineering Materials, pp. 805 - 808, http://dx.doi.org/10.4028/0-87849-427-8.805

Ma PC; Kim JK; Tang BZ, 2007, 'Silane functionalization of carbon nanotubes (CNTs)and its effects on the properties of CNT/epoxy nanocomposites', in ICCM International Conferences on Composite Materials

Zhu H; Woo RSC; Leung CKY; Kim JK, 2007, 'Wear resistance of organic nanocomposites', in Key Engineering Materials, pp. 605 - 608, http://dx.doi.org/10.4028/0-87849-427-8.605

Ma PC; Kim J-K; Tang BZ, 2006, 'Coating carbon nanotubes with silver nanoparticles to get conductive nanocomposites', in 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, IEEE, PEOPLES R CHINA, Kowloon, pp. 128 - +, presented at International Conference on Electronic Materials and Packaging, PEOPLES R CHINA, Kowloon, 11 December 2006 - 14 December 2006

Ma PC; Kim JK; Tang BZ, 2006, 'Coating carbon nanotubes with silver nanoparticles to get conductive nanocomposites', in 2006 International Conference on Electronic Materials and Packaging, EMAP, http://dx.doi.org/10.1109/EMAP.2006.4430578

Woo RSC; Chen Y; Kim JK; Zhu H; Leung CKY, 2006, 'Degradation and residual properties of UV exposed epoxy-clay nanocomposites', in International SAMPE Symposium and Exhibition (Proceedings)

Ma P; Kim J-K; Tang BZ, 2006, 'PMSE 414-Organic nanotubes derived from dendrons with cyclodextrin-inclusion complex and their supramolecular transformation', in ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, AMER CHEMICAL SOC, pp. 184 - 184

Ding Y; Kim JK; Tong P, 2006, 'Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy', in Mechanics of Materials, pp. 11 - 24, http://dx.doi.org/10.1016/j.mechmat.2005.05.007

Hu C; Kim JK, 2005, 'Epoxy-organoclay nanocomposites: Morphology, moisture absorption behavior and thermo-mechanical properties', in Composite Interfaces, pp. 271 - 289, http://dx.doi.org/10.1163/1568554053971597

Chan YH; Kim JK; Liu D; Liu PCK; Cheung YM; Ng MW, 2005, 'Improvements in Au wire bondability of rigid and flexible substrates using plasma cleaning', in 2005 6th International Conference on Electronics Packaging Technology, pp. 366 - 371, http://dx.doi.org/10.1109/ICEPT.2005.1564609

Sham ML; Kim JK; Lee RSW; Wu J; Yuen MMF, 2004, 'Effects of underfill adhesion on flip chip package reliability', in Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC), pp. 96 - 101

Lo JCC; Lee SWR; Wu JS; Kim JK; Yuen MMF, 2004, 'Chip-on-chip 3D optical interconnect with passive alignment', in Proceedings - Electronic Components and Technology Conference, pp. 2015 - 2019

Kim JK, 2004, 'Electronic packaging activities in Hong Kong and surrounding region', in Advancing Microelectronics, pp. 27

Sham ML; Kim JK; Park JH, 2003, 'Viscoelastic properties of underfill for numerical analysis of flip chip packages', in Proceedings - Electronic Components and Technology Conference, pp. 560 - 566

Tsui YK; Lee SWR; Wu JS; Kim JK; Yuen MMF, 2003, 'Three-dimensional packaging for multi-chip module with through-the-silicon via hole', in Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003, pp. 1 - 7, http://dx.doi.org/10.1109/EPTC.2003.1271480

Lebbai M; Lam OYM; Kim JK, 2002, 'Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide surface', in 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2002 - Conference Proceedings, pp. 54 - 62, http://dx.doi.org/10.1109/POLYTR.2002.1020183

Park J; Dai Y; Kim JK, 2002, 'Singularity of interface stresses in fibre push-out test', in Key Engineering Materials, pp. 7 - 16

Chan YH; Kim JK; Liu D; Liu CK; Cheung YM; Ng MW, 2002, 'Wire bondability of Au/Ni bond pads: Effects of metallisation schemes and processing conditions', in Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, pp. 69 - 76, http://dx.doi.org/10.1109/EMAP.2002.1188815

Sham ML; Kim JK, 2001, 'Measurement of residual stresses in flip chip underfill resins', in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics, pp. 160 - 167

Sham ML; Lam M; Kim JK, 2001, 'Adhesion characteristics of underfill material with various package components after plasma and UV/ozone treatments', in Advances in Electronic Materials and Packaging 2001, pp. 208 - 215, http://dx.doi.org/10.1109/EMAP.2001.983986

Szeto WK; Chum CC; Kim JK; Sze A; Cheung YM, 2001, 'Feasibility and characterization study of Al and Au wire bonding on immersion Ag and Sn coatings', in Advances in Electronic Materials and Packaging 2001, pp. 56 - 62, http://dx.doi.org/10.1109/EMAP.2001.983958

Lebbai M; Kim JK; Yuen MMF; Tong P, 2000, 'Effect of black copper oxide on interface adhesion between copper substrate and glob-top resin', in 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000, pp. 61 - 69, http://dx.doi.org/10.1109/ADHES.2000.860575

Sham ML; Kim JK, 2000, 'Effects of flux residue and thermomechanical stresses on delamination failure in flip chip packages', in International Symposium on Electronic Materials and Packaging, EMAP 2000, pp. 274 - 281, http://dx.doi.org/10.1109/EMAP.2000.904167

Szeto WK; Xie MY; Kim JK; Yuen MMF; Tong P; Yi S, 2000, 'Interface failure criterion of button shear test as a means of interface adhesion measurement in plastic packages', in International Symposium on Electronic Materials and Packaging, EMAP 2000, pp. 263 - 268, http://dx.doi.org/10.1109/EMAP.2000.904165

Lebbai M; Szeto WK; Kim JK, 2000, 'Optimization of black oxide coating thickness as adhesion promoter for copper substrate', in International Symposium on Electronic Materials and Packaging, EMAP 2000, pp. 206 - 213, http://dx.doi.org/10.1109/EMAP.2000.904156

Tong P; Lam DCC; Yuen MMF; Kim JK; Lee RSW; Lee SHK; Chan P, 1999, 'Global collaborative electronic packaging education', in Proceedings - Electronic Components and Technology Conference, pp. 907 - 911

Dai Y; Kim JK; Ji X; Xue ST, 1998, 'An Analysis of Singularity in Single Fibre Pull-Out Test Using BEM', in Key Engineering Materials, pp. 595 - 600

Baillie C; Kim JK; Mai YW, 1993, 'Comparison of two single fibre interface tests', in Proceedings of the International Conference on Advanced Composite Materials, pp. 715 - 721

Kim JK; Mai YW, 1993, 'Optimization of toughness and strength properties in fibre composites with controlled interfaces', in Proceedings of the International Conference on Advanced Composite Materials, pp. 69 - 77

Conference Abstracts

LI Y; Luo Z; Wong H; Wang J; Peng W; Shen Y; Xu M; An Q; Kim JK; Yuan B; Goddard W, 2023, 'Horizontally Aligned Zn Crystals Deposition with 1T VSe₂ Functional Layer for Dendrite-Free Zn Metal Anodes', in ECS Meeting Abstracts, The Electrochemical Society, Vol. MA2023-01, pp. 2790 - 2790, http://dx.doi.org/10.1149/ma2023-0172790mtgabs

Preprints

Liu D; Zhang H; Chen H; Lee J-H; Guo F; Shen X; Zheng Q-B; Kim J-K, Wrinkled, Cracked and Bridged Carbon Networks for Highly Sensitive and Stretchable Strain Sensors, http://dx.doi.org/10.2139/ssrn.4088193

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