ORCID as entered in ROS
https://orcid.org/0000-0002-5390-8763
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Conference Papers
, 2007, 'Functionalization of multi-walled carbon nanotubes via UV/O
, 2007, 'Percolation threshold of polymer nanocomposites containing graphite nanoplatelets and carbon nanotubes', in ICCM International Conferences on Composite Materials
, 2007, 'Self-healing glass fibres with carbon nanotube-epoxy nanocomposite coating', in Key Engineering Materials, pp. 805 - 808, http://dx.doi.org/10.4028/0-87849-427-8.805
, 2007, 'Silane functionalization of carbon nanotubes (CNTs)and its effects on the properties of CNT/epoxy nanocomposites', in ICCM International Conferences on Composite Materials
, 2007, 'Wear resistance of organic nanocomposites', in Key Engineering Materials, pp. 605 - 608, http://dx.doi.org/10.4028/0-87849-427-8.605
, 2006, 'Coating carbon nanotubes with silver nanoparticles to get conductive nanocomposites', in 2006 International Conference on Electronic Materials and Packaging, EMAP, http://dx.doi.org/10.1109/EMAP.2006.4430578
, 2006, 'Degradation and residual properties of UV exposed epoxy-clay nanocomposites', in International SAMPE Symposium and Exhibition (Proceedings)
, 2006, 'Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy', in Mechanics of Materials, pp. 11 - 24, http://dx.doi.org/10.1016/j.mechmat.2005.05.007
, 2005, 'Epoxy-organoclay nanocomposites: Morphology, moisture absorption behavior and thermo-mechanical properties', in Composite Interfaces, pp. 271 - 289, http://dx.doi.org/10.1163/1568554053971597
, 2005, 'Improvements in Au wire bondability of rigid and flexible substrates using plasma cleaning', in 2005 6th International Conference on Electronics Packaging Technology, pp. 366 - 371, http://dx.doi.org/10.1109/ICEPT.2005.1564609
, 2004, 'Effects of underfill adhesion on flip chip package reliability', in Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC), pp. 96 - 101
, 2004, 'Chip-on-chip 3D optical interconnect with passive alignment', in Proceedings - Electronic Components and Technology Conference, pp. 2015 - 2019
, 2004, 'Electronic packaging activities in Hong Kong and surrounding region', in Advancing Microelectronics, pp. 27
, 2003, 'Viscoelastic properties of underfill for numerical analysis of flip chip packages', in Proceedings - Electronic Components and Technology Conference, pp. 560 - 566
, 2003, 'Three-dimensional packaging for multi-chip module with through-the-silicon via hole', in Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003, pp. 1 - 7, http://dx.doi.org/10.1109/EPTC.2003.1271480
, 2002, 'Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide surface', in 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2002 - Conference Proceedings, pp. 54 - 62, http://dx.doi.org/10.1109/POLYTR.2002.1020183
, 2002, 'Singularity of interface stresses in fibre push-out test', in Key Engineering Materials, pp. 7 - 16
, 2002, 'Wire bondability of Au/Ni bond pads: Effects of metallisation schemes and processing conditions', in Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, pp. 69 - 76, http://dx.doi.org/10.1109/EMAP.2002.1188815
, 2001, 'Measurement of residual stresses in flip chip underfill resins', in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics, pp. 160 - 167
, 2001, 'Adhesion characteristics of underfill material with various package components after plasma and UV/ozone treatments', in Advances in Electronic Materials and Packaging 2001, pp. 208 - 215, http://dx.doi.org/10.1109/EMAP.2001.983986
, 2001, 'Feasibility and characterization study of Al and Au wire bonding on immersion Ag and Sn coatings', in Advances in Electronic Materials and Packaging 2001, pp. 56 - 62, http://dx.doi.org/10.1109/EMAP.2001.983958
, 2000, 'Effect of black copper oxide on interface adhesion between copper substrate and glob-top resin', in 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000, pp. 61 - 69, http://dx.doi.org/10.1109/ADHES.2000.860575
, 2000, 'Effects of flux residue and thermomechanical stresses on delamination failure in flip chip packages', in International Symposium on Electronic Materials and Packaging, EMAP 2000, pp. 274 - 281, http://dx.doi.org/10.1109/EMAP.2000.904167
, 2000, 'Interface failure criterion of button shear test as a means of interface adhesion measurement in plastic packages', in International Symposium on Electronic Materials and Packaging, EMAP 2000, pp. 263 - 268, http://dx.doi.org/10.1109/EMAP.2000.904165
, 2000, 'Optimization of black oxide coating thickness as adhesion promoter for copper substrate', in International Symposium on Electronic Materials and Packaging, EMAP 2000, pp. 206 - 213, http://dx.doi.org/10.1109/EMAP.2000.904156
, 1999, 'Global collaborative electronic packaging education', in Proceedings - Electronic Components and Technology Conference, pp. 907 - 911
, 1998, 'An Analysis of Singularity in Single Fibre Pull-Out Test Using BEM', in Key Engineering Materials, pp. 595 - 600
, 1993, 'Comparison of two single fibre interface tests', in Proceedings of the International Conference on Advanced Composite Materials, pp. 715 - 721
, 1993, 'Optimization of toughness and strength properties in fibre composites with controlled interfaces', in Proceedings of the International Conference on Advanced Composite Materials, pp. 69 - 77
Conference Abstracts
, 2023, 'Horizontally Aligned Zn Crystals Deposition with 1T VSe2 Functional Layer for Dendrite-Free Zn Metal Anodes', in ECS Meeting Abstracts, The Electrochemical Society, Vol. MA2023-01, pp. 2790 - 2790, http://dx.doi.org/10.1149/ma2023-0172790mtgabs
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https://orcid.org/0000-0002-5390-8763